Mechanisms of radical production in CF3Cl, CF3Br, and related plasma etching gases: The role of added oxidants
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References (13)
Plasma etching—A discussion of mechanisms
1979 • 559 citations
Plasma etching of Si and SiO2—The effect of oxygen additions to CF4 plasmas
1978 • 533 citations
The reaction of fluorine atoms with silicon
1981 • 322 citations
Plasma etching of Si and SiO2 in SF6–O2 mixtures
1981 • 265 citations
Anisotropic plasma etching of polysilicon
1980 • 136 citations
Energy balance in low-pressure gas discharges
1973 • 103 citations
The plasma oxidation of CF4 in a tubular-alumina fast-flow reactor
1979 • 94 citations
The effect of added hydrogen on the rf discharge chemistry of CF4, CF3H, and C2F6
1979 • 82 citations
The absorption spectrum of CF2
1950 • 67 citations
Etching and film formation in CF3Br plasmas: some qualitative observations and their general implications
1980 • 43 citations
Mechanisms of radical production in radiofrequency discharges of CF3Cl, CF3Br, and certain other plasma etchants: Spectrum of a transient species
1980 • 38 citations
Aluminum Etching in Carbon Tetrachloride Plasmas
1980 • 37 citations
Chemical Reactivity of CF4 and C2F4 Induced by Electrical Discharge
1955 • 7 citations