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Thermal stresses and cracking resistance of dielectric films (SiN, Si3N4, and SiO2) on Si substrates
Data up to Jan 2025
Published1978
Citations261
References7
Total Citations Per Year
Abstract
References (7)
The tension of metallic films deposited by electrolysis
1909 • 4,668 citations
Calculated elastic constants for stress problems associated with semiconductor devices
1973 • 1,187 citations
Measurement of Strains at Si-SiO2 Interface
1966 • 394 citations
The temperature dependence of stresses in aluminum films on oxidized silicon substrates
1978 • 112 citations
Thermal Expansion of Sputtered Silicon Nitride Films
1969 • 64 citations
Lorentz-Lorenz correlation for reactively plasma deposited Si-N films
1978 • 63 citations
Thermal Expansion Coefficient of a Pyrolitically Deposited Silicon Nitride Film
1967 • 43 citations
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