H₂O₂ as a modifier of phenol–formaldehyde resin used in the production of particleboards

Bonding Surface Activated Hardwood Flakeboard with Phenol-Formaldehyde Resin

1991 • 15 citations

Phenol-formaldehyde resin curing and bonding under dynamic conditions

1996 • 9 citations

Bonding Surface Activated Hardwood Flakeboard with Phenol-formaldehyde Resin. I. Physical and Mechanical Properties

1990 • 7 citations

Hydrogen Peroxide as a Resin Cure Accelerator

1986 • 6 citations